High Power LED and Thermal Management

摘要

A high-power-SMD-LED (HILLED) outline 3,3 x 2,9 mm~2 was developed, with chip-size up to 1 mm~2 and power dissipation up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The thermal resistance is 12 K/W. For high integrated applications (spotlights, general lighting) special PCBs with isolating layers thinner than 10 μm (commercial solutions: 75 μm) was developed also. Modules on 1 mm copper, area 40 x 40 mm~2 with 100 HL-LEDs, P_(tot) = 50 W, P_(opt)= 8 W in amber (592 nm) and thermal resistant 6 K/W were demonstrated.