首页> 外文会议>International Symposium for Testing and Failure Analysis(ISTFA 2004); 20051106-10; San Jose,CA(US) >The Study and Methodology of Defects Isolation for Contacts of Non-isolated Active Regions on New Logic Designs
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The Study and Methodology of Defects Isolation for Contacts of Non-isolated Active Regions on New Logic Designs

机译:新逻辑设计中非隔离有源区触点缺陷隔离的研究和方法

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摘要

With the advancement in technology and lower operating voltage, new standards have evolved in circuit layout and design. Some of these new standards have increased the difficulties of the physical failure analysis process, especially on the front-end. The phenomenon described in this paper is the unusual voltage contrast (VC) and conductive atomic force microscope (C-AFM) curve on a non-isolated active region. The model and mechanism are demonstrated for front-end failure analysis. Based on this, the solution for analysis is investigated.
机译:随着技术的进步和较低的工作电压,电路布局和设计方面的新标准已经发展。其中一些新标准增加了物理故障分析过程的难度,尤其是在前端。本文描述的现象是非隔离有源区域上的异常电压对比度(VC)和导电原子力显微镜(C-AFM)曲线。演示了用于前端故障分析的模型和机制。基于此,研究了用于分析的解决方案。

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