A Novel DC-DC Converter Using LTCC Technology for Magnetic Integration Application

摘要

@@ The latest communication systems demand evergreater functionality, higher performance, and lower cost in smaller and lighter formats. The power supply modules, especially DC-DC convertors, which cover significant space in the wireless communication terminals and systems. To reduce the size and weight of DC-DC convenor is the key issue to achieve system miniaturization. Magnetics is the major bottleneck and challenge for achieving compact high power density DC-DC convertor. Therefore, how to design a highly integrated DC-DC convenor has become a widespread interest around the world both in industry and the academia. In recent years, low-temperature co-fired ceramic (LTCC) technologies are widely used for their superior advantages over other substrate technologies, such as three-dimensional (3-D) integration capabilities which can make sizereduction and low-cost design, small value of dielectric loss tangent which offers excellent high frequency characteristics for microwave integrated circuits, and low cost for high-volume production.