Microelectronic Packaging and Heat sink Components with Controlled Functionality using Novel Powder Injection Molding Technique

摘要

Two-material combinations to form a single component are possible through traditional welding or brazing process, but a more cost-effective and higher quality method is to assemble different components into one integrated geometry through co-molding and sintering. Controlled sintering is the major challenge with these structures, where differential shrinkage strains result in delamination, warpage or cracking. Considerable process adjustments are needed in solids loading, particle size and heating cycle to minimize damage during heating. The final object has an integral metallurgical bond, yet consists of two different functional properties. Candidate applications include new thermal management device with selective placement of thermal properties, electronic sensor with selective magnetic response at different locations and glass-metal sealing components. The scale-up of the process is demonstrated with several geometries and applications.