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CHARACTERIZATION OF POLYSILSESQUIOXANE BASED LOW-K DIELECTRICS

机译:聚倍半硅氧烷低钾介电常数的表征

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摘要

Structural characterization of polysilsesquioxanes was conducted using IR spectroscopy. It was found that hydrogen and phenyl silsesquioxane polymers exhibit more symmetric ring structure compared to that for methyl silsesquioxane before curing and structural transformation occurs as increasing the cure temperature. The onset temperature of structural transformation is highly dependent on the organic group R. In addition, IR and NMR analysis show that the preparation condition of silsesquioxane polymers has a significant effect on the chemical structure, functionality and molecular weight. Variation in mechanical properties of polysilsesquioxane was also examined as a function of curing time, temperature and molecular weight using TBA, nanoindenter and microvicker test.
机译:聚倍半硅氧烷的结构表征使用红外光谱进行。已经发现,与甲基倍半硅氧烷相比,氢和苯基倍半硅氧烷聚合物表现出更对称的环结构,因为固化温度升高,固化和结构转变发生。结构转变的起始温度高度依赖于有机基团R。此外,IR和NMR分析表明倍半硅氧烷聚合物的制备条件对化学结构,官能度和分子量具有显着影响。还使用TBA,纳米压头和显微维氏测试检查了聚倍半硅氧烷的机械性能变化与固化时间,温度和分子量的关系。

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