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Micro-structuring of Photonic Materials by Deep-ultraviolet Laser

机译:深紫外激光对光子材料的微结构化

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摘要

157nm deep-ultraviolet laser is considered as one of good 3D micro-structuring tools. In this study, a micro-fabrication system based on the 157 nm laser is conducted to micro-structuring experiments of photonic materials. For laser ablation of fused silica, the ablation rate is about 80nm/pulse under laser fluence of 5 J/cm~2. A micro-hole array is produced in silica glass chip, and several 3D microstructures are ablated into SMF-28 optical fibers. Experiments and analysis show that, material removal is dominantly photon-chemical process in case of 157nm laser machining.
机译:157nm深紫外激光被认为是良好的3D微结构化工具之一。在这项研究中,基于157 nm激光的微细加工系统被用于光子材料的微细结构实验。对于熔融石英的激光烧蚀,在5 J / cm〜2的激光通量下,烧蚀速率约为80nm /脉冲。在石英玻璃芯片中产生一个微孔阵列,并在SMF-28光纤中烧蚀了一些3D微观结构。实验和分析表明,在157nm激光加工中,材料去除主要是光子化学过程。

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