Nano- and micro-structuring of silicon with laser using a laser-induced plasma for the treatment of the laser beam of processing (Machine-translation by Google Translate, not legally binding)

摘要

Nano- and micro-structuring of silicon with laser using a laser-induced plasma for processing the laser beam. The method object of the invention is characterized in that it comprises an ablation stage, in which a first pulsed laser ablation beam is incised, with a fluence in the range 10-100 jcm-2, on the surface of a metallic sample generating a laser-induced plasma; and a processing step, in which a second pulsed, processing laser beam is incised, with a creep of 0.3 jcm-2, retarded with respect to the ablation laser beam, between 0.1 and 1 microsecond, on a silicon surface next to the laser-induced plasma so that said second laser beam crosses said plasma perpendicularly with respect to the axis of expansion of the plasma. (Machine-translation by Google Translate, not legally binding)