ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC

摘要

The aluminium brazing technology, widely used for heat exchangers in automotive applications, is now implemented in Aavid Thermalloy with high volumes production capacity for manufacturing high efficiency and compact coolers for high power density devices. Technological, compact and cost effective coolers are required because extruded heatsinks, also if enhanced with forced ventilation, cannot guarantee the thermal resistance required by the new electronic components. The traditional heatsink limit is due to the not best conductivity of extruded aluminium and of the not optimised fin design. Solutions like bonded fins and folded fins are already in the market with very good results, but they have already reached the limit of the technology and designers want to eliminate completely the thermal gap base to fins with a real All-Metal-Joint. Liquid coolers solve many design problems but are still expensive solutions. Aavid Thermalloy presents 5 applications (2 patented) based on aluminium brazing: two in forced ventilation and three based on liquid cooling that brilliantly joint the low thermal resistance with the economical advantages of industrialization. Introduced in Aavid Thermalloy one year ago, the applications are now already on the market available for industrial mass production. The presentation is completed with comparative thermal and mechanical performances analysis, based on Icepak fluodynamic software and laboratory test reports and with economical evaluation charts.