Design and Modeling of a New Thermocouple Structure for Microwave Power Measurements

摘要

Design and modeling of a new micro-bridge thermocouple structure as a microwave power sensor are presented. Computer simulation using a finite element analysis (FEA) software is carried out on the thermal and mechanical behavior of the sensor under different input power levels. The simulation results show that the micro-bridge structure reduces the thermal conducting paths and raises the temperature difference between hot and cold joints, compared with a traditional membrane structure. A microwave power sensor with the new structure is fabricated by MEMS technology. Simulated and experimental results are proved to be in good agreement. The sensor has a sensitivity as high as 1mV/mW over power level from 10 μ W to 100mW.