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Formation of the atomically smooth surface of gold film and binding of gold nano-particles on it by self-assembly method

机译:自组装方法形成金膜原子光滑表面并与金纳米颗粒结合

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We have developed the technique of the surface's roughness decrease of gold films to atomic level. This technique consists of the accurate annealing of fresh-evaporated gold films by hot plate at temperature 250℃ (or by free flame of gas-jet (T~700℃)). Films were evaporated thermally on atomically smooth mica substrates. The annealing of the gold film was carried out just after evaporation. The atomically smooth surface of gold film was obtained. The atomically smooth (roughness ~ 0.2 nm) regions have a sizes of 50-100 nm. It was found that the time from the end of evaporation process to the beginning of annealing process should be not more than 10 hours as well as a delay of the implementation of self-assembly process with annealed films and the analysis of results should be not more than 2 days.rnThere was developed the method of gold nano-particles binding on the prepared by such way gold films. Evaporated and annealed gold film was treated by dithiol solution (1,2-ethanedithiol or 1,4-butanedithiol) with concentration of 0.05 g/mg and after that the samples were treated by the solution of gold nano-particles (2~*10~(-3) -2.5~*10~(-5) mol/l). We have sorted out the optimal concentrations of gold nano-particles in various solvents, temperature and process duration which exclude the nano-particles' conglomeration and guarantee the uniform distribution of nano-particles on film surface. The absence of nano-particles' conglutination was confirmed by the examination of samples with Scanning Tunneling Microscope and Scanning Electron Microscope. These examinations demonstrate the uniform distribution of small (3-13 nm) nano-particles on gold surface with the density of about 3 particles per 1000 nm~2.
机译:我们已经开发了将金膜表面粗糙度降低到原子水平的技术。该技术包括通过在250℃的温度下热板(或通过气体喷射的自由火焰(T〜700℃))对新鲜蒸发的金膜进行精确退火。在原子光滑的云母基底上热蒸发薄膜。金膜的退火仅在蒸发后进行。获得了金膜的原子光滑表面。原子光滑区域(粗糙度约0.2 nm)的大小为50-100 nm。发现从蒸发过程结束到退火过程开始的时间应不超过10小时,并且退火膜的自组装过程的实施应延迟,并且结果分析不应超过10小时。在不到两天的时间内,人们就开发出了通过这种方法制备的金纳米颗粒与金膜结合的方法。用浓度为0.05 g / mg的二硫醇溶液(1,2-乙二硫醇或1,4-丁二硫醇)处理蒸发退火后的金膜,然后用金纳米颗粒溶液(2〜* 10)处理样品。 〜(-3)-2.5〜* 10〜(-5)mol / l)。我们已经选择了在各种溶剂,温度和工艺持续时间中金纳米粒子的最佳浓度,这些浓度排除了纳米粒子的团聚并保证了纳米粒子在薄膜表面的均匀分布。通过用扫描隧道显微镜和扫描电子显微镜检查样品来确认不存在纳米颗粒的凝集。这些检查证明了小(3-13 nm)纳米粒子在金表面上的均匀分布,其密度约为每1000 nm〜2 3个粒子。

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