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Joining Mechanism of Static Bonding Between β ' -Al2O3and L2-Aluminum

机译:β“ -Al2O3与L2-铝之间静态键合的连接机理

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Electrostatic bonding, as a special method of solid-state diffusion bonding for the ceramics and the metals, can be performed at low temperature quickly and conveniently. And It’s suitable for making micro electromechanical system (MEMS), such as micro-devices, solar cell and micro-sensors [1] . So Electrostatic bonding process mainly is used to bond the fast-ion conductivity materials and the metals. The bonding technique of functionally materials and metals had a significant role in the manufacture of MEMS [2] . In this paper, the L2 aluminum film and β ′′-Al2O3 sheet were bonded by the electrostatic bonding process. SEM, EDX,XRD were applied to investigate the interfacial structure and composition of the samples, and the bonding mechanism and technical condition were characterized precisely.The experimental results showed that the electrolyte ceramics and aluminum can be bonded very well. The bonding area was composed of Al metal, transition area and aluminum oxide. The successful bonding was achieved due to the formation of the oxide in the interface. The main factors that influenced the bonding process were voltage, temperature and the electrical conductivity of the materials.
机译:作为用于陶瓷和金属的固态扩散键合的一种特殊方法,静电键合可以在低温下快速方便地进行。而且它适用于制造微机电系统(MEMS),例如微设备,太阳能电池和微传感器[1]。因此,静电键合工艺主要用于快速离子导电材料与金属的键合。功能材料和金属的键合技术在MEMS的制造中起着重要作用[2]。在本文中,L2铝膜和β′-Al2O3片通过静电粘合工艺粘合。用SEM,EDX,XRD对样品的界面结构和组成进行了研究,并精确表征了其结合机理和工艺条件。实验结果表明,电解质陶瓷与铝可以很好地结合。结合区域由铝金属,过渡区域和氧化铝组成。由于在界面中形成了氧化物,因此成功实现了粘合。影响键合过程的主要因素是电压,温度和材料的电导率。

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