Connecting solder partners used in die bonding or chip bonding comprises heating the solder partners so that a solder depot melts and is pulled by capillary forces into a joining region to join the solder partners

摘要

Connecting a first solder partner (20) to a second solder partner (10) comprises placing the first solder partner, the second solder partner and a solder depot (30) so that one surface (20a) of the first solder partner lies opposite one surface (10a) of the second solder partner, and heating the solder partners so that the solder depot melts and is pulled by capillary forces into a joining region to join the solder partners through a joining layer. An Independent claim is also included for a composite arrangement made from the solder partners.