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Simulation of Proton Induced Single Event Upsets in Bulk Nano-CMOS SRAMs

机译:质子纳米CMOS SRAM中质子诱导的单事件翻转的模拟

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Proton-induced single event upsets (SEUs) are a significant threat to reliability of integrated circuits (ICs) for working in harsh space environment. In this paper, a novel nested simulation model of static random access memory (SRAM) processed with 65nm bulk technology is built. The average charge collection coefficient of each sub-sensitive volume (SV) is calculated by point charge integration. The vulnerability of SRAM due to proton strike is evaluated using Monte Carlo simulation method based on the Geant4 simulation toolkit. The simulation results of protons with different energy show that the low energy protons can generate enough energy due to direct ionization and lead to high SEU cross-sections. For high-energy protons (>10MeV), SEU cross-sections increase with the increasing incident angle. For low-energy proton (<;10MeV), the cross sections of SRAMs reach the maximum at 63.4°. Moreover, multiple cell upsets (MCUs) can be caused by the recoil-ions generated from reactions of protons and tungsten layer. Finally, the SRAM cell spacing can evidently influence SEU cross-sections. Simulation results show that the mitigation effect of increasing cell spacing is weakened as the increase of incident proton energy. Thus, more attention must be paid when adopting the method that increasing cell spacing to mitigate the impact of proton radiation.
机译:质子引起的单事件扰动(SEU)对在恶劣的空间环境中工作的集成电路(IC)的可靠性构成重大威胁。本文建立了一种新型的65nm批量技术处理的静态随机存取存储器(SRAM)的嵌套仿真模型。每个亚敏感体积(SV)的平均电荷收集系数通过点电荷积分计算。使用基于Geant4仿真工具包的Monte Carlo仿真方法评估了质子撞击导致的SRAM漏洞。具有不同能量的质子的模拟结果表明,低能质子由于直接电离可产生足够的能量,并导致高SEU截面。对于高能质子(> 10MeV),SEU截面随入射角的增加而增加。对于低能质子(<; 10MeV),SRAM的横截面在63.4°处达到最大值。此外,质子和钨层反应产生的反冲离子可能引起多个细胞不适(MCU)。最后,SRAM单元间距显然可以影响SEU横截面。仿真结果表明,随着入射质子能量的增加,增加晶格间距的缓解效果减弱。因此,在采用增加细胞间隔以减轻质子辐射影响的方法时,必须更加注意。

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