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Mechanisms of atmospheric neutron-induced single event upsets in nanometric SOI and bulk SRAM devices based on experiment-verified simulation tool

机译:基于实验验证的仿真工具的纳米SOI和体SRAM器件中大气中子诱发单事件扰动的机制

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摘要

In this paper,a simulation tool named the neutron-induced single event effect predictive platform (NSEEP2) is proposed to reveal the mechanism of atmospheric neutron-induced single event effect (SEE) in an electronic device,based onheavy-ion data and Monte-Carlo neutron transport simulation.The detailed metallization architecture and sensitive volume topology of a nanometric static random access memory (SRAM) device can be considered to calculate the real-time soft error rate (RTSER) in the applied environment accurately.The validity of this tool is verified by real-time experimental results.In addition,based on the NSEEP2,RTSERs of 90 nm-32 nm silicon on insulator (SOI) and bulk SRAM device under various ambient conditions are predicted and analyzed to evaluate the neutron SEE sensitivity and reveal the underlying mechanism.It is found that as the feature size shrinks,the change trends of neutron SEE sensitivity of bulk and SOI technologies are opposite,which can be attributed to the different MBU performances.The RTSER of bulk technology is always 2.8-64 times higher than that of SOI technology,depending on the technology node,solar activity,and flight height.
机译:在本文中,基于重离子数据和蒙特Carlo中子输运模拟。可以考虑纳米静态静态随机存取存储器(SRAM)器件的详细金属化架构和敏感体积拓扑结构,以准确计算应用环境中的实时软错误率(RTSER)。此外,基于NSEEP2,预测并分析了90nm-32nm绝缘体上硅(SOI)和体SRAM器件在各种环境条件下的RTSER,以评估中子SEE灵敏度并揭示研究发现,随着特征尺寸的缩小,大体积中子SEE灵敏度和SOI技术的变化趋势相反,这可以归因于MBU的性能各不相同。散装技术的RTSER始终比SOI技术高2.8-64倍,具体取决于技术节点,太阳能活动和飞行高度。

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  • 来源
    《中国物理:英文版》 |2018年第6期|334-338|共5页
  • 作者单位

    Key Laboratory of Low Dimensional Materials & Application Technology of Ministry of Education, Xiangtan University, Xiangtan 411100, China;

    Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China;

    Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China;

    Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China;

    Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, China;

  • 收录信息 中国科学引文数据库(CSCD);中国科技论文与引文数据库(CSTPCD);
  • 原文格式 PDF
  • 正文语种 eng
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