首页> 外文会议>International Conference on Frontiers of Design and Manufacturing(ICFDM'2006) vol.3; 20060619-22; Guangzhou(CN) >RESEARCH ON BONDING MECHANISM OF INTERNAL VOIDS IN BULK FORGINGS BY PHYSICAL MODEL SIMULATING
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RESEARCH ON BONDING MECHANISM OF INTERNAL VOIDS IN BULK FORGINGS BY PHYSICAL MODEL SIMULATING

机译:用物理模型模拟研究散装锻件内部空隙的结合机理。

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摘要

In term of the diffusion welding theory, temperature, pressure and holding time are the key parameters to eliminate the internal voids of bulk forgings. Aiming at the diffusion bonding mechanism, a new physical model applied with shear stress is set up and compared with the common model through analysing the three phases of diffusion bonding process in this paper. The physical simulation experiment is done on Gleeble-3500 machine and the key parameters for diffusion bonding process are discussed by observation of the microscopic structure of the bonding interface from experimental results, which shows that the macro shear deformation is helpful to hasten the bonding process.
机译:根据扩散焊接理论,温度,压力和保持时间是消除散装锻件内部空隙的关键参数。针对扩散键合机理,通过分析扩散键合过程的三个阶段,建立了一个新的施加剪切应力的物理模型,并与普通模型进行了比较。在Gleeble-3500机器上进行了物理模拟实验,并通过观察实验结果观察了键合界面的微观结构,讨论了扩散键合过程的关键参数,表明宏观剪切变形有助于加快键合过程。

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