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Device-Aware Test: A New Test Approach Towards DPPB Level

机译:设备感知测试:DPPB级别的新测试方法

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This paper proposes a new test approach that goes beyond cell-aware test, i.e., device-aware test. The approach consists of three steps: defect modeling, fault modeling, and test/DfT development. The defect modeling does not assume that a defect in a device (or a cell) can be modeled electrically as a linear resistor (as the traditional approach suggests), but it rather incorporates the impact of the physical defect on the technology parameters of the device and thereafter on its electrical parameters. Once the defective electrical model is defined, a systematic fault analysis (based on fault simulation) is performed to derive appropriate fault models and subsequently test solutions. The approach is demonstrated using two memory technologies: resistive random access memory (RRAM) and spin-transfer torque magnetic random access memory (STT-MRAM). The results show that the proposed approach is able to sensitize faults for defects that are not detected with the traditional approach, meaning that the latter cannot lead to high-quality test solutions as required for a defective part per billion (DPPB) level. The new approach clearly sets up a turning point in testing for at least the considered two emerging memory technologies.
机译:本文提出了一种新的测试方法,该方法超越了单元感知测试(即设备感知测试)。该方法包括三个步骤:缺陷建模,故障建模和测试/ DfT开发。缺陷建模并不假定可以将设备(或电池)中的缺陷建模为线性电阻器(如传统方法所示),而是将物理缺陷对设备技术参数的影响纳入其中然后是它的电气参数。一旦定义了有缺陷的电气模型,便会进行系统的故障分析(基于故障仿真),以得出适当的故障模型并随后测试解决方案。使用两种存储技术演示了该方法:电阻式随机存取存储器(RRAM)和自旋传递扭矩磁性随机存取存储器(STT-MRAM)。结果表明,所提出的方法能够区分传统方法无法检测到的缺陷,这意味着传统方法无法产生针对十亿分之缺陷零件(DPPB)级别所需的高质量测试解决方案。新方法显然为至少被认为是两种新兴内存技术的测试设定了一个转折点。

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