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Applications of Three Dimensional Laser Induced Metallization Technology with Polymer Coating

机译:聚合物涂层三维激光诱导金属化技术的应用

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A fully developed technology of three dimensional laser induced metallization (LIM) on molded interconnect devices (MIDs) is widely used on various products. The target substrate is sprayed with a special thin layer (50 $mu m$) polymer coating first, and heated at 80 °C to cure. Then using laser to define the pattern of conductors and induce the catalyst in the special polymer layer. After the electroless copper plating, the pattern is metallized. The whole process can be fully copy again on layer-by-layer to achieve the idea of multi-layer. For the high feasibility on any complex surface and material, such as glass, plastic, ceramic, etc., the LIMtechnology can be used for vary kind of products. In this paper, the LIM technology has applied on QR code stickers, 2G/3G/4G all-in-one compact antenna, mm-wave antenna, built-in antenna on mobile phone case, multi-layer NFC antenna, and humanoid robot finger. The QR code can be patterning on a thin film of 100 um and with a great flexibility. In addition, the return loss of 2G/3G/4G all-in-one compact antenna reaches the 3:1 VSWR standard, and the radiation efficiency is larger than 60% within the operation frequency. The built-in antenna on mobile phone case can reduce the waste of space and strongly secure the antenna from detachment. The LIM technology applied on the ceramic substrate can successfully fabricate a high directionality 38GHz mm-wave antenna and with above 10dBi of array gain, average efficiency up to 50%, and bandwidth up to 2 GHz. Furthermore, the multi-layer NFC antenna can successfully reduce the size and reach the maximum read distance of 3 cm. Using the same idea of multi-layer, the capacitive tactile sensor that can sense both normal and shear force is placed on humanoid robot finger to provide the tactile ability. The products described above will be briefly introduced in this paper and related testing results will be mentioned.
机译:模制互连设备(MID)上的三维激光诱导金属化(LIM)的全面开发技术已广泛用于各种产品。首先在目标基板上喷涂一层特殊的薄层聚合物涂层(50微米),然后在80°C加热固化。然后使用激光确定导体的图案,并在特殊的聚合物层中引发催化剂。在化学镀铜之后,图案被金属化。整个过程可以逐层再次完全复制,以实现多层的想法。由于在任何复杂的表面和材料(例如玻璃,塑料,陶瓷等)上都具有很高的可行性,因此LIM技术可用于各种产品。本文将LIM技术应用于二维码贴纸,2G / 3G / 4G一体式紧凑型天线,毫米波天线,手机外壳内置天线,多层NFC天线和类人机器人手指。 QR码可以在100 um的薄膜上进行构图,并且具有很大的灵活性。此外,2G / 3G / 4G多合一紧凑型天线的回波损耗达到了3:1 VSWR标准,在工作频率范围内辐射效率大于60%。手机外壳上的内置天线可以减少空间浪费,并牢固地防止天线脱落。应用于陶瓷基板的LIM技术可以成功制造高指向性38GHz毫米波天线,并且阵列增益超过10dBi,平均效率高达50%,带宽高达2 GHz。此外,多层NFC天线可以成功减小尺寸并达到3厘米的最大读取距离。使用多层的相同思想,可以感应法向力和剪切力的电容式触觉传感器都放置在人形机器人手指上,以提供触觉能力。本文将简要介绍上述产品,并提及相关的测试结果。

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