Methods and Means of Incoming Quality Inspection of Printed Circuit Boards

摘要

The paper presents the main results of scientific and practical research on the incoming inspection of PCB products. The application of various methods of defective constructions and topology of multilayer PCBs is considered: visual (microvision), ultrasonic, radiographic, in-circuit and peripheral scanning. The main technical characteristics of equipment and software for each of the methods are presented and recommendations are offered for their optimal application for different types of production.