A printed circuit substrate appearance inspection method comprising: an inspection area defining step defining a predetermined inspection area on an image of a printed circuit substrate including a component mounted on the printed circuit substrate; and an appearance inspection step carrying out appearance inspection of the component by analyzing image data in the thus-defined inspection area, wherein: the inspection area defining step comprises the steps of; detecting a printed substrate pattern part around the component on the printed circuit substrate; and defining the predetermined inspection without overlapping with the thus-detected printed substrate pattern part.
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