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High-speed CMOS compatible photodetectors for optical interconnects

机译:用于光学互连的高速CMOS兼容光电探测器

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We have developed high-speed germanium (Ge) photodetectors using standard complementary metal-oxide-semiconductor (CMOS) process technology. We describe the design considerations that led to the devices reported on here. We have characterized these detectors in terms of the following detector metrics: speed, responsivity, dark current and capacitance. The photodetectors exhibit responsivities greater than 0.2 AAV at both 850 and 1550 nm, making them compatible with both long- and short-haul communication systems. Impulse response measurements at both of the above wavelengths indicate 3 dB cutoff frequencies greater than 10 GHz and open eye diagrams have been measured at 20 Gb/s. Dark currents are on the order of 10 to 1000 μA at a bias of 1 V depending on device size. Capacitances measured were on the order of 0.1-10 fF. The performance of the detectors indicates that they are suitable for high speed on-chip optical links. Device simulation models indicate that the fundamental upper limit on the speed of the devices, based on ideal material properties, is high enough to support a number of process generations. Calibration of the models to our experimental data is presented, and areas for improvement are defined.
机译:我们已经使用标准的互补金属氧化物半导体(CMOS)工艺技术开发了高速锗(Ge)光电探测器。我们描述了导致此处报告的设备的设计注意事项。我们已根据以下检测器指标对这些检测器进行了表征:速度,响应度,暗电流和电容。光电探测器在850和1550 nm处的响应度都大于0.2 AAV,这使其与长途和短途通信系统兼容。在上述两个波长下的脉冲响应测量表明3 dB截止频率大于10 GHz,并且以20 Gb / s的速度测量了睁眼图。暗电流大约为10至1000μA,偏置电压为1 V,具体取决于器件尺寸。测得的电容约为0.1-10 fF。检测器的性能表明它们适用于高速片上光学链路。器件仿真模型表明,基于理想的材料特性,器件速度的基本上限足够高,足以支持多个工艺世代。介绍了根据我们的实验数据对模型进行的校准,并定义了需要改进的地方。

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