ONE PROCESS, DIFFERENT RESULTS: METHODOLOGIES FOR ANALYZING A STENCIL PRINTING PROCESS USING PROCESS CAPABILITY INDEX ANALYSES

摘要

The purpose of this paper is to compare and contrastrndifferent stencil printing process capability results thatrncan be obtained from the same data points, dependingrnupon how the data are analyzed. In estimating a printingrnprocess' capability to deposit solder paste, it is a commonrnpractice (see Mukadam et al. (2002) for example) tornutilize process capability indices (like Cp, Cpk, and others).rnOne set of data, depending upon how it is analyzed, canrnactually provide different values for the index beingrninvestigated. For example, if one is interested in therncapability of the process for meeting the specifications onrnone particular component, different results could bernobtained if the data were analyzed in the following ways:rnboard-to-board, all deposits, parallel vs. perpendicular padrnorientation (w.r.t. squeegee blade direction), and others.rnThis paper will provide an example case study and showrnthat one process, depending upon how it is viewed orrnanalyzed, will in fact produce various results via processrncapability index analysis.