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Light-Activated Shape Memory Polymers and Associated Applications

机译:光活化形状记忆聚合物及其相关应用

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Continuous product development and technology integration efforts using shape memory polymers (SMPs) have uncovered a need for faster response times. As with most smart materials, SMP responds to a specific stimulus. Traditionally SMP is triggered by thermal stimulus; increasing the temperature of the SMP above a T_g will transition the polymer from a glassy state to a rubbery state. The transition is reversible upon cooling below the T_g. It has been determined that many SMP applications can be significantly enhanced with non-thermal triggering. Non-thermal triggering eliminates the need for heating mechanisms and reduces cycle time. Furthermore, it has been found that with a faster response time many new applications become viable. Previous successful attempts have been made to improve response time of SMP by increasing its thermal conductivity with various thermally conductive additives. However, thermal heating and cooling of polymers and composites of substantial thickness, thermally conductive or not, takes time. In an effort to facilitate system integration and increase the response time of SMP, researchers at Cornerstone Research Group, Inc. (CRG) have sought to eliminate the thermal dependency of SMP by developing light-activated shape memory polymer (LASMP). In this work, monomers which contain photo-crosslinkable groups in addition to the primary polymerizable groups were developed. These monomers were formulated and cured with other monomers to form LASMP. The mechanical properties of these materials, the kinetics, and the reversibility of the light-activated shape memory effect were studied. The near-, mid-, and far-term potential of this new material technology for system level applications is discussed.
机译:使用形状记忆聚合物(SMP)的持续产品开发和技术集成努力已经揭示了对更快响应时间的需求。与大多数智能材料一样,SMP响应特定的刺激。传统上,SMP是由热刺激触发的。将SMP的温度提高到T_g以上将使聚合物从玻璃态转变为橡胶态。在冷却到T_g以下时,转变是可逆的。已经确定,通过非热触发可以大大增强许多SMP应用。非热触发消除了对加热机制的需求,并缩短了循环时间。此外,已经发现,随着响应时间的缩短,许多新应用程序变得可行。以前已经进行了成功的尝试,以通过使用各种导热添加剂来提高SMP的导热率来改善SMP的响应时间。然而,对相当大厚度的聚合物和复合材料进行热加热和冷却,无论是否具有导热性,都需要时间。为了促进系统集成并增加SMP的响应时间,Cornerstone Research Group,Inc.(CRG)的研究人员已寻求通过开发光活化形状记忆聚合物(LASMP)来消除SMP的热依赖性。在这项工作中,开发了除初级可聚合基团外还包含光可交联基团的单体。配制这些单体并与其他单体固化形成LASMP。研究了这些材料的机械性能,动力学和光激活形状记忆效应的可逆性。讨论了这种新材料技术在系统级应用中的近期,中期和远期潜力。

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