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New anode design concept of 600V thin wafer PT-IGBT with very low dose p-buffer and transparent p-emitter

机译:具有非常低剂量的p缓冲器和透明p发射极的600V薄晶圆PT-IGBT的新阳极设计概念

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摘要

We propose 600V new thin wafer PT (Punch Through) IGBT having a new concept of anode design. This proposed PT-IGBT has a very low dose p-type layer, called p-buffer, between a transparent p-emitter (anode) and an n-buffer layer. This provides a practical design for easy fabrication without deteriorating the good feature of the thin wafer PT-IGBTs. The n-buffer dose and the p-emitter dose can be precisely controlled by the doses of the two ion implantations. This is great merit in precise control of the p-emitter injection efficiency. An oscillation in the turn-off waveforms also disappears for the proposed PT-IGBT with p-buffer layer, because a smooth turn-off is achieved by a small tail current. The total power loss is not affected by the small tail loss.
机译:我们提出具有阳极设计新概念的600V新型薄晶圆PT(穿通)IGBT。提出的PT-IGBT在透明p发射极(阳极)和n缓冲层之间有一个非常低剂量的p型层,称为p缓冲层。这提供了易于制造的实用设计,而不会降低薄晶圆PT-IGBT的良好功能。可以通过两次离子注入的剂量精确控制n缓冲剂量和p发射极剂量。这在精确控制p发射极注入效率方面非常重要。对于建议的带有p缓冲层的PT-IGBT,截止波形中的振荡也消失了,因为通过小的尾电流实现了平稳的截止。总功率损耗不受小尾损耗的影响。

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