Quasi-3D Thermal/fluid Analysis for Electronics Packaging

摘要

1) Do detailed models enable, or do they constrain? 1. Are you contributing to a design in the early phases, or just "blessing" a design too late to influence it? 2. At what point does increased detail eliminate uncertainties? How do you know if these uncertainties affect design risk? 2) Is increased fidelity a Wise use of Moore's Law? 1. Does evaluation of a single, deterministic point design represent a useful engineering task, or does it just represent what current software can do? 2. How valuable would thousands of simpler analyses be if they could investigate sensitivities, bottlenecks, design variations, usage scenarios, etc.?