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Design and Process Considerations in Transitioning To Aluminum Ribbon

机译:过渡到铝带的设计和工艺考虑

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摘要

Bonding of power devices is experiencing a rapid transition to aluminum ribbon for many reasons. Better electrical characteristics,improved heat dissipation,fewer bonds,and improved reliability are some of the most obvious advantages. The huge increase in battery powered motors that require more powerful devices in smaller packages also increases the need for ribbon bonding. SPM has developed SPM POWER BOND RIBBON~TM,a high purity corrosion resistant aluminum bonding ribbon,to meet this demand. New improved spooling is now available for ribbons as large as .080 X .010,and as small as .030 X .003 mil. This spooling method decreases or eliminates most of the traditional issues with despooling of bonding ribbons and is compatible with the most commonly used bonding machines. Several Bonder Manufacturers have introduced new equipment to handle the conversion to heavy aluminum ribbon. Design consideration must be given to items such as bond pad design,loop heights,bonding angles and more. A key point to consider is that fact that one bond of a given size Bonding Ribbon can replace several wire bonds. For example: one bond of .060 X .008 ribbon can replace 6 wires of .010 diameter. This is key to increasing throughput and reliability and ultimately reducing costs. This paper will address the basic design characteristics that need to be considered in order to take advantage of this emerging technology.
机译:由于许多原因,功率器件的粘接正迅速过渡到铝带。更好的电气特性,改进的散热,更少的键合以及改进的可靠性是最明显的优势。电池驱动电动机的大量增加,要求在更小封装中使用更强大的设备,这也增加了对碳带焊接的需求。 SPM开发了SPM POWER BOND RIBBON〜TM,这是一种高纯度的耐腐蚀铝粘合带,可以满足这一需求。现在提供了新的改进的卷轴,可用于大至.080 X .010和小至.030 X .003 mil的色带。这种绕线方法减少或消除了粘接带脱线的大多数传统问题,并且与最常用的粘接机兼容。数家邦德制造商已经引进了新设备来处理向重铝带的转换。必须考虑诸如焊盘设计,环路高度,粘结角度等项目的设计注意事项。要考虑的一个关键点是,给定大小的键合带的一个键合可以替代多个导线键合。例如:.060 X .008碳带的一键可以代替6根.010直径的线。这是提高产量和可靠性并最终降低成本的关键。本文将介绍利用这一新兴技术需要考虑的基本设计特征。

著录项

  • 来源
  • 会议地点 San Jose CA(US)
  • 作者单位

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 F: (914) 273-2065 Email: citaliano@sempck.com;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 F: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 F: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 F: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 F: (914) 273-2065;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路(IC);
  • 关键词

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