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An Assessment of Parallel Connected Silicon Carbide based Electronic Switches

机译:基于并联连接的碳化硅电子开关的评估

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In this paper, an analysis of the behavior of an electronic switch using SiC-MOSFET semiconductors connected in parallel to be able to raise the working power of the electronic switch is presented. In regards to detect any problems of parallel operation of SiC-MOSFET, the current's switching waveforms of each device and their corresponding sum were detailed observed in through experimental implementations in a bidirectional switch. Source current of the parallel SiC-MOSFET with separate gate driver, drain current of those with separate gate driver, and drain current of one with single gate driver were examined. Even though two heat sinks were separated and switching frequency was 156 kHz, the temperature of the two SiC-MOSFET was 36°C in ambient temperature of 25°C exhibiting excellent thermal stability. Switching waveforms of drain current of the parallel SiC-MOSFET with single gate driver gave the best results.
机译:在本文中,对使用并联连接的SiC-MOSFET半导体以提高电子开关的工作功率的电子开关的性能进行了分析。关于检测SiC-MOSFET并联运行的任何问题,通过双向开关中的实验实现,详细观察了每个器件的电流开关波形及其相应的总和。检查了具有独立栅极驱动器的并联SiC-MOSFET的源极电流,具有独立栅极驱动器的并联SiC-MOSFET的漏极电流以及具有单个栅极驱动器的并联SiC-MOSFET的漏极电流。即使两个散热器分开且开关频率为156 kHz,两个SiC-MOSFET的温度在25°C的环境温度下仍为36°C,具有出色的热稳定性。具有单栅极驱动器的并联SiC-MOSFET的漏极电流的开关波形给出了最佳结果。

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