Flex PCBMEMS for system size miniaturization

摘要

PCBMEMS have previously been incorporated within rigid substrates. Flexible laminates are also possible to incorporate PCBMEMS, called Flex PCBMEMS, and at times are desirable for maximum packing density and miniaturization. In this work demonstrations using 2D to 3D packaging transforms on a compact heated fluorometer block are presented. In one case the optoelectronic reference block is further integrated using flexible PCB/MEMS. The block is transformed with the insertion of a polyimide flex opto/mechanical/electrical interconnect skin. In a second example the block is further miniaturized into a mini tube using planar fabrication and flexible folding of the fluorometer system. This design, fabrication and construction approach allows lightweight, complex, space efficient systems. Flex PCBMEMS permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. Using this path Flex PCBMEMS can approach the creativity and complexity of natural systems.