The purpose of the multichip module (MCM) project discussed was todevelop and test a moderately complex, high-performance MCM, and indoing so, to determine the feasibility and constraints of using thisapproach to high-density hybrid integration. The end product was to be aworking MCM prototype that could be characterized and tested at speed.The project was divided into four phases: (1) vendor evaluation; (2)electrical design; (3) mechanical design; and (4) reevaluation. Eachphase is described. This work led to the determination that MCMs are aviable technology when speed and real estate are design drivers. It wasfound that maintaining good communications with the vendor throughoutthe design cycle is important. The limitations on the design tools mayrequire the use of multiple tools to verify the functionality andperformance of an MCM
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