Yield and reliability concerns in polyimide based multi-chipmodules

摘要

The key technology elements used in the fabrication of ahigh-performance, low-cost silicon-on-silicon multichip module (MCM) aredescribed. Al/PI multilayer substrates, flip-chip soldering of chips tosubstrate, and wire bonding of substrate to a ceramic pin grid array(PGA) package were the various interconnection elements used. Some ofthe yield and reliability issues encountered in the manufacture of thesubstrates, the flip-chip process, and wire bonding of the Al/PIstructures are discussed, and process changes made to solve some ofthese problems are presented