By utilizing conventional IC processing techniques, a membraneprobe card has been fabricated on a silicon wafer and its functionalitydemonstrated. The probe card was able to provide a very large number ofprobe tips in an array form, permanently fixed in the X-Y plane via a transparent, flexible membrane. The use of anelectrical current pulse, instead of a mechanical scrubbing motion, tobreak down the interfacial oxide has been demonstrated. The contactresistance was about 5×10-5 Ω-cm2. Thenew probe card offers smaller probe parasitics. The addition of theactive test circuitry on the probe card would allow very high speedwafer level testing
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