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Efficient scrub mechanisms for error-prone emerging memories

机译:有效的擦洗机制,易于出错的新兴存储器

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Many memory cell technologies are being considered as possible replacements for DRAM and Flash technologies, both of which are nearing their scaling limits. While these new cells (PCM, STT-RAM, FeRAM, etc.) promise high density, better scaling, and non-volatility, they introduce new challenges. Solutions at the architecture level can help address some of these problems; e.g., prior research has proposed wear-leveling and hard error tolerance mechanisms to overcome the limited write endurance of PCM cells. In this paper, we focus on the soft error problem in PCM, a topic that has received little attention in the architecture community. Soft errors in DRAM memories are typically addressed by having SECDED support and a scrub mechanism. The scrub mechanism scans the memory looking for a single-bit error and corrects it before the line experiences a second uncorrectable error. However, PCM (and other emerging memories) are prone to new sources of soft errors. In particular, multi-level cell (MLC) PCM devices will suffer from resistance drift, that increases the soft error rate and incurs high overheads for the scrub mechanism. This paper is the first to study the design of architectural scrub mechanisms, especially when tailored to the drift phenomenon in MLC PCM. Many of our solutions will also apply to other soft-error prone emerging memories. We first show that scrub overheads can be reduced with support for strong ECC codes and a lightweight error detection operation. We then design different scrub algorithms that can adaptively trade-off soft and hard errors. Using an approach that combines all proposed solutions, our scrub mechanism yields a 96.5% reduction in uncorrectable errors, a 24.4 × decrease in scrub-related writes, and a 37.8% reduction in scrub energy, relative to a basic scrub algorithm used in modern DRAM systems.
机译:许多存储单元技术都被认为是DRAM和Flash技术的可能替代品,两者均已接近其扩展极限。这些新单元(PCM,STT-RAM,FeRAM等)有望实现高密度,更好的缩放比例和非易失性,但它们带来了新的挑战。架构级别的解决方案可以帮助解决其中的一些问题。例如,先前的研究提出了磨损均衡和硬错误容忍机制,以克服PCM单元有限的写入耐久性。在本文中,我们关注于PCM中的软错误问题,这个问题在体系结构社区中很少受到关注。 DRAM存储器中的软错误通常通过具有SECDED支持和清理机制来解决。清理机制会扫描内存以查找单个位错误,并在行遇到第二个不可纠正的错误之前对其进行纠正。但是,PCM(和其他新兴的存储器)容易出现软错误的新来源。尤其是,多级单元(MLC)PCM器件将遭受电阻漂移的影响,这会增加软错误率,并会给清理机制带来高昂的开销。本文是第一篇研究建筑擦洗机制设计的文章,特别是针对MLC PCM中的漂移现象进行量身定制的研究。我们的许多解决方案也将适用于其他容易出现软错误的新兴存储器。我们首先表明,通过支持强大的ECC代码和轻量级的错误检测操作,可以减少清理开销。然后,我们设计可以自适应权衡软错误和硬错误的不同清理算法。与现代DRAM中使用的基本擦洗算法相比,使用结合了所有建议解决方案的方法,我们的擦洗机制可将无法纠正的错误减少96.5%,与擦洗相关的写入减少24.4×,并将擦洗能量减少37.8%。系统。

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