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High-Contrast Gratings for Long-Wavelength Laser Integration on Silicon

机译:用于硅上长波长激光集成的高对比度光栅

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Silicon photonics is increasingly considered as the most promising way-out to the relentless growth of data traffic in today's telecommunications infrastructures, driving an increase in transmission rates and computing capabilities. This is in fact challenging the intrinsic limit of copper-based, short-reach interconnects and microelectronic circuits in data centers and server architectures to offer enough modulation bandwidth at reasonable power dissipation. In the context of the heterogeneous integration of Ⅲ-Ⅴ direct-bandgap materials on silicon, optics with high-contrast metastructures enables the efficient implementation of optical functions such as laser feedback, input/output (I/O) to active/passive components, and optical filtering, while heterogeneous integration of Ⅲ-Ⅴ layers provides sufficient optical gain, resulting in silicon-integrated laser sources. The latest ensure reduced packaging costs and reduced footprint for the optical transceivers, a key point for the short reach communications. The invited talk will introduce the audience to the latest breakthroughs concerning the use of high-contrast gratings (HCGs) for the integration of Ⅲ-Ⅴ-on-Si vertical-cavity surface-emitting lasers (VCSELs) as well as Fabry-Perot edge-emitters (EELs) in the main telecom band around 1.55 μm. The strong near-field mode overlap within HCG mirrors can be exploited to implement unique optical functions such as dense wavelength division multiplexing (DWDM): a 16-λ 100-GHz-spaced channels VCSEL array is demonstrated. On the other hand, high fabrication yields obtained via molecular wafer bonding of Ⅲ-Ⅴ alloys on silicon-on-insulator (SOI) conjugate excellent device performances with cost-effective high-throughput production, supporting industrial needs for a rapid research-to-market transfer.
机译:硅光子技术日益被认为是当今电信基础设施中数据流量不断增长的最有希望的出路,推动了传输速率和计算能力的提高。实际上,这挑战了数据中心和服务器体系结构中基于铜的短距离互连和微电子电路的固有限制,以在合理的功耗下提供足够的调制带宽。在硅上Ⅲ-Ⅴ类直接带隙材料的异质集成的情况下,具有高对比度元结构的光学器件可以有效地实现光学功能,例如激光反馈,有源/无源组件的输入/输出(I / O),光学滤光,同时Ⅲ-Ⅴ层的异质集成提供了足够的光学增益,从而形成了硅集成激光源。最新的技术可确保降低包装成本并减少光收发器的占地面积,这是短距离通信的关键点。受邀的演讲将向观众介绍有关使用高对比度光栅(HCG)集成Ⅲ-Ⅴ-Si垂直腔表面发射激光器(VCSEL)和Fabry-Perot边缘的最新突破主电信频段中的电子发射器(EEL)约为1.55μm。可以利用HCG镜中的强近场模式重叠来实现独特的光学功能,例如密集波分复用(DWDM):演示了16-λ100 GHz间隔的通道VCSEL阵列。另一方面,通过绝缘体上硅(SOI)上的Ⅲ-Ⅴ合金分子晶片键合获得的高制造成品率使优异的器件性能与具有成本效益的高通量生产相结合,满足了工业界对快速研究的需求。市场转移。

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