首页> 外文会议>Gallium Nitride Materials and Devices II; Proceedings of SPIE-The International Society for Optical Engineering; vol.6473 >Nitride-based light-emitting diodes with p-AlInGaN surface layers prepared at various temperatures
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Nitride-based light-emitting diodes with p-AlInGaN surface layers prepared at various temperatures

机译:在不同温度下制备具有p-AlInGaN表面层的氮化物基发光二极管

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摘要

We have prepared bulk p-AlInGaN layers and light emitting diodes (LEDs) with p-AHnGaN surface layers by metalorganic chemical vapor deposition (MOCVD). It was found that surfaces of the LEDs with p-AlInGaN layers were rough with high density of hexagonal pits. It was also found that pit width and pit density depend on the growth temperature of the p-AlInGaN layer. Furthermore, it was found that we can achieve 62% enhancement in output intensity from the LED with 820℃ p-AlInGaN cap layer without increasing the LED operation voltage.
机译:我们已经通过有机金属化学气相沉积(MOCVD)制备了块状p-AlInGaN层和具有p-AHnGaN表面层的发光二极管(LED)。发现具有p-AlInGaN层的LED的表面是粗糙的,具有高密度的六边形凹坑。还发现凹坑宽度和凹坑密度取决于p-AlInGaN层的生长温度。此外,我们发现使用820℃p-AlInGaN覆盖层可以将LED的输出强度提高62%,而无需增加LED工作电压。

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