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Low Pt loading thin cathode catalyst layer by Reactive Spray Deposition Technology

机译:反应喷涂技术制备低铂含量的薄阴极催化剂层

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The Reactive Spray Deposition Technology (RSDT) process allows for composite electrode layer formation and low loading electrocatalysts. The RSDT process provides the production means necessary to develop next generation thin, low platinum or alloyed catalyst layers for PEM MEA's. A gradient with controlled porosity and controlled distribution of both platinum and ionomer across the catalyst layer is possible with the RSDT process. Platinum particles are created directly from metal vapours whose size is controlled by the process. In our design, a platinum sublayer (100 nm) was deposited directly on a Nafion~R NRE211 membrane as a columnar structure. After the sub-layer, the platinum loading was reduced in a co-deposited layer of Pt-Nafion (ionomer)-carbon with the lowest loading closest to the GDL. The combined loading of both layers was <0.05mg/cm~2 Pt with this approach. The manufactured catalyst layer has a performance of 0.65V at 1 A/cm~2 with 0.05mg/cm~2 Pt loading using oxygen.
机译:反应喷涂技术(RSDT)工艺允许形成复合电极层和低负荷电催化剂。 RSDT工艺提供了开发用于PEM MEA的下一代薄,低铂或合金薄催化剂层所必需的生产手段。使用RSDT工艺,可以实现具有受控孔隙率和受控的铂和离聚物在催化剂层中分布的梯度。铂颗粒直接由金属蒸气产生,其尺寸受工艺控制。在我们的设计中,铂亚层(100 nm)以柱状结构直接沉积在Nafion〜R NRE211膜上。在该子层之后,铂负载量在最接近GDL的最低负载量的Pt-Nafion(离聚物)-碳共沉积层中降低。用这种方法,两层的总负载为<0.05mg / cm〜2 Pt。所制得的催化剂层在1 A / cm〜2的条件下具有0.65V的性能,使用氧气的负载量为0.05mg / cm〜2 Pt。

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