The prediction of Micro/Nano voids in glass frit ring by simulation

摘要

The voids at the glass frit bonding interface and inside the frit layer not only provide leakage pathways to deteriorate the sealing performance, but also reduce the effective contact area of the bonding interface to decrease the bonding strength. In this research, the micro composite glass frit bonding structure with redundant bleeding frit and bonding gap controllable was designed as the model to predict the emergence of the Micro/Nano voids. The transient temperature field of the phase transition of the glass frit and the temperature gradient distribution in the solidification process of the glass frit were attained by simulation with Ansys. And the Niyama shrinkage porosity (hole) criterion was applied to predict the distribution position, distribution density and dimension of the Micro/Nano voids.