ALTERNATIVE METALIZATION TECHNOLOGIES FOR FLEXIBLE CIRCUITS AND DIFFICULT TO METALIZE SUBSTRATES

摘要

With double digit growth in the foreseeable future, flexible printed circuits (FPC), have found a niche as an enabler for various applications. Flexible Printed Circuits (FPC) have found use in flip chip packaging and in other significant interconnect applications. These trends are expected to drive the need to increase productivity while improving performance and reducing costs in FPC manufacturing. One method to meet these requirements is to employ continuous reel to reel or conveyorized panel processing. However, small and medium sized fabricators must carefully select metalization options because of space and capital expense outlays. One such option is to utilize a direct metalization process based on a highly conductive form of graphite. The author will present detailed information on direct metalization technology with particular emphasis adhesion of graphite to flexible materials. Emphasis will also be placed on electroplating of copper over the graphite-based coating. A second purpose of the discussion will center on the use of modified permanganate desmear processes for FPC in contrast with plasma.