Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests

摘要

In the current study, solder joint integrity was investigated using high speed shear and pull tests on a newly developed bond tester. Solder ball attachment strengths and failure modes were recorded together with fracture energies. Lead-free and lead-tin solders were compared on various pad finishes. Fracture surfaces were examined to assess failure modes and fracture location. More brittle fractures were observed with increasing speed in all types of packages and in both test configurations, but differences between solder types were clear. Correlations between failure mode, strength and energy are discussed. The effect of shear tool height on high speed shear test results is also discussed.