首页> 外文会议>EPP-vol.5; ASME(American Society of Mechanical Engineers) International Mechanical Engineering Congress and Exposition; 20051105-11; Orlando,FL(US) >CONVECTIVE HEAT TRANSFER FROM A STATIONARY OR ROTATING MCM DISK WITH A UNCONFINED ROUND JET IMPINGEMENT
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CONVECTIVE HEAT TRANSFER FROM A STATIONARY OR ROTATING MCM DISK WITH A UNCONFINED ROUND JET IMPINGEMENT

机译:固定的或旋转的MCM盘对流传热,不受圆形射流冲击

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摘要

A series of experimental investigations with stringent measurement methods on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based MCM disk with unconfined jet impingement have been successfully conducted. The relevant parameters influencing fluid flow and heat transfer performance are (1) mixed convection due to jet impingement and buoyancy: steady-state Grashof number, jet Reynolds number, and ratio of jet separation distance to nozzle diameter; and (2) mixed convection due to jet impingement, disk rotation and buoyancy: steady-state Grashof number, jet Reynolds number (Re_j), rotational Reynolds number (Re_r), ratio of jet separation distance to nozzle diameter (H/d). The thermal behavior explored includes the transient temperature distribution on the MCM disk surface, transient heat flux distribution of input power, transient convective heat flux distribution of chips, and transient chip and average heat transfer characteristics on the MCM disk surface. Besides, two new correlations of transient stagnation and average Nusselt numbers in terms of Re_j, H/d and t are presented for the cases of stationary MCM disk. For the cases of rotating MCM disk, a new empirical correlation to classify two regimes of heat transfer modes such as disk rotation mode and jet impingement mode is presented; and a complete composite correlation of steady-state average Nusselt number for mixed convection due to jet impingement, disk rotation and buoyancy is proposed. As compared with the steady-state results, if the transient chip and average heat transfer behaviors may be considered as a superposition of a series of quasi-steady states, the transient chip and average Nusselt numbers in all the present transient experiments can be properly predicted by the existing steady-state correlations when t > 6 min in the power-on transient period.
机译:已经成功地进行了一系列严格的测量方法实验研究,这些研究涉及从水平无限制的静止或旋转陶瓷基MCM盘进行无限制射流冲击的流体流动和瞬态混合对流。影响流体流动和传热性能的相关参数是:(1)由于射流撞击和浮力引起的混合对流:稳态格拉斯霍夫数,射流雷诺数以及射流分离距离与喷嘴直径之比; (2)由于射流撞击,盘旋转和浮力引起的混合对流:稳态格拉斯霍夫数,射流雷诺数(Re_j),旋转雷诺数(Re_r),射流分离距离与喷嘴直径之比(H / d)。研究的热行为包括MCM磁盘表面上的瞬态温度分布,输入功率的瞬态热通量分布,芯片的瞬态对流热通量分布以及MCM磁盘表面上的瞬态芯片和平均传热特性。此外,针对静止MCM磁盘情况,还给出了关于Re_j,H / d和t的瞬时停滞和平均Nusselt数的两个新的相关性。对于旋转的MCM盘,提出了一种新的经验相关性来对两种传热模式进行分类,例如盘旋转模式和射流冲击模式。提出了射流撞击,圆盘旋转和浮力作用下混合对流稳态平均努塞尔数的完整复合关系。与稳态结果相比,如果可以将瞬态芯片和平均传热行为视为一系列准稳态的叠加,则可以正确预测所有当前瞬态实验中的瞬态芯片和平均努塞尔数在上电瞬态期间t> 6 min时,通过现有的稳态相关性来确定。

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