ANALYTICAL SOLUTION FOR BGA MODULES UNDER THERMAL/MECHANICAL LOADING

摘要

This paper presents an advanced approach to obtain analytical solutions for BGA-type package or module under both thermal loading and mechanical bending. The theoretical framework is based on two-dimensional theory of plate pure bending. Solder joint shear strain distribution has been derived analytically. Specifically, the joint strain has been correlated with measured board strain. The approach developed and analytical solutions obtained are very useful for rapid component qualification in terms of solder joint reliability.