The use and emissions of perfluorocompounds (PFCs) in the semiconductor manufacturing industry has received significant attention over the past 5 years. Focused efforts to evaluate various technologies to reduce these emissions have been underway for the last 3-4 years. Chamber cleans utilizing NF_3 as the primary fluorine source have been shown to greatly reduce PFC emissions from the thin films area of a fab. Both in-situ and remote plasma chamber cleaning have been demonstrated by various semiconductor manufacturing companies, and both are supported by various industry equipment suppliers. Both techniques will likely play a significant role in long term PFC emissions reduction.
展开▼
