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Development of Imprint Materials for the Step and Flash Imprint Lithography Process

机译:步进和闪光压印光刻工艺的压印材料的开发

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The Step and Flash Imprint Lithography (S-FIL~(TM)) process is a step and repeat nano-replication technique based on UV curable low viscosity liquids. Molecular Imprints, Inc. (MII) develops commercial tools that practice the S-FIL process. This talk will present the imprint materials that have been developed to specifically address the issue of process life and defects. The S-FIL process involves field-to-field dispensing of low viscosity ( < 5 cps) UV cross-linkable monomer mixtures. The low viscosity liquid leads to important advantages that include: 1. Insensitivity to pattern density variations 2. Improved template life due to a lubricated template-wafer interface avoids "hard contact" between template and wafer 3. Possibility for lubricated (in-situ) high-resolution alignment corrections prior to UV exposure The materials that are optimal for use hi the S-FIL process need to possess optimal wetting characteristics, low evaporation, no phase separation, excellent polymer mechanical properties to avoid cohesive failure in the cured material, low adhesion to the template, and high adhesion to the underlying substrate. Over 300 formulations of acrylate based monomer mixtures were developed and studied. The imprint materials were deemed satisfactory based on the process of surviving imprinting more than 1500 imprints without the imprints developing systematic or repeating defects. For the purpose of these process studies, printing of sub-100 nm pillars and contacts is used since they represent the two extreme cases of patterning challenge: pillars are most likely to lead to cohesive failure in the material; and contacts are most likely to lead to mechanical failure of the template structures.
机译:分步和快速压印光刻技术(S-FIL〜)是一种基于UV固化的低粘度液体的分步重复纳米复制技术。 Molecular Imprints,Inc.(MII)开发了实践S-FIL工艺的商业工具。本演讲将介绍为解决工艺寿命和缺陷问题而专门开发的压印材料。 S-FIL工艺涉及低粘度(<5 cps)的紫外线可交联单体混合物的现场分配。低粘度液体具有重要的优势,包括:1.对图案密度变化不敏感2.润滑的模板-晶圆界面可延长模板寿命,避免模板与晶圆之间的“硬接触” 3.润滑(原位)的可能性紫外线照射前的高分辨率对准校正最适合在S-FIL工艺中使用的材料必须具有最佳的润湿特性,低蒸发,无相分离,优异的聚合物机械性能,以避免固化材料的内聚破坏,低对模板的附着力强,对下层基材的附着力强。开发和研究了300多种丙烯酸酯基单体混合物的配方。基于压印材料能够存活超过1500个压印,而压印没有出现系统性或重复性缺陷,该工艺被认为是令人满意的。为了进行这些过程研究,使用了100 nm以下的柱和触点的印刷,因为它们代表了构图挑战的两种极端情况:柱最有可能导致材料的内聚破坏。和接触最有可能导致模板结构的机械故障。

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