首页> 外文会议>Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th >Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material
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Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material

机译:金线热超声键合中的热影响区和金属间化合物的形成与线材的关系

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The paper is focused on the Heat Affected Zone (HAZ) and Inter-Metallic Compound (IMC) formation in gold wire bonding using different dopants in gold wire material. The HAZ is studied as a function of different current in the free air ball settings. It has been identified that high Ca dopant containing gold wire significantly leads to less inter metallization reaction of components in between Gold and Aluminum when compared with low Ca dopant containing gold wire. Similarly high Ca dopant containing gold wire has less HAZ when compared to low Ca dopant containing gold wires. The detailed analysis has been carried out with the help optical microscopy, Field Emission Scanning Electron Microscope (FE-SEM) and Energy Dispersive X-ray (EDX) spectroscopy.
机译:本文重点研究了金线焊接中使用不同掺杂物的金线材料中的热影响区(HAZ)和金属间化合物(IMC)的形成。在自由球设置中,根据不同电流对HAZ进行了研究。已经发现,与低Ca掺杂的金线相比,高Ca掺杂的金线显着导致金和铝之间的组分之间的金属间化反应更少。类似地,与含低钙掺杂剂的金线相比,含高钙掺杂剂的金线具有较小的HAZ。借助辅助光学显微镜,场发射扫描电子显微镜(FE-SEM)和能量色散X射线(EDX)光谱仪进行了详细的分析。

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