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Packaging of Light Emitting Diodes for Display Backlights: Need for Multi-Disciplinary Design Tools

机译:用于显示背光源的发光二极管的包装:需要多学科设计工具

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摘要

This paper discusses the modelling tools used to predict the performance of a liquid crystal display using an array of light emitting diodes (LEDs) as the backlight. LEDs can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes the current modelling efforts underway in this multi-disciplinary UK funded project that aims at identifying the intricate relationships between the optical, thermal and mechanical behaviour when developing a ruggedized electronic display using an array of LEDs as the backlight.
机译:本文讨论了用于预测使用一系列发光二极管(LED)作为背光的液晶显示器性能的建模工具。 LED可以提供许多好处,例如自适应光控制,减小的外形尺寸和其他新颖的技术,以最终改善显示器的性能。采用LED的一些设计挑战是要充分了解它们对显示器的热管理,可靠性,光学性能和可见性的影响。对于展示设计师来说,这需要集成的建模和分析工具。本文描述了在这个由英国资助的多学科项目中当前正在进行的建模工作,该项目旨在确定开发使用LED阵列作为背光的加固型电子显示器时光学,热和机械行为之间的复杂关系。

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  • 会议地点 Beijing(CN)
  • 作者单位

    School of Computing and Mathematical Sciences, University Of Greenwich, Park Row,Greenwich, London, SE10 9LS, United KingdomColin CartwrightUniversity of Abertay, Dundee, UK;

    School of Computing and Mathematical Sciences, University Of Greenwich, Park Row,Greenwich, London, SE10 9LS, United KingdomColin CartwrightUniversity of Abertay, Dundee, UK;

    School of Computing and Mathematical Sciences, University Of Greenwich, Park Row,Greenwich, London, SE10 9LS, United KingdomColin CartwrightUniversity of Abertay, Dundee, UK;

    School of Computing and Mathematical Sciences, University Of Greenwich, Park Row, Greenwich, London, SE10 9LS, United Kingdom Colin Cartwright University of Abertay, Dundee, UK;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
  • 关键词

  • 入库时间 2022-08-26 13:50:28

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