School of Electrical and Electronic Engineering, Nanyang Technological University, 639798, Singapore;
Laboratoire Matériaux et Phénomènes Quantiques, Université Paris Diderot, 75205, France;
Agency for Science, Technology and Research (A*STAR), Institute of Microelectronics, 117685, Singapore;
Agency for Science, Technology and Research (A*STAR), Institute of Microelectronics, 117685, Singapore;
School of Electrical and Electronic Engineering, Nanyang Technological University, 639798, Singapore;
School of Electrical and Electronic Engineering, Nanyang Technological University, 639798, Singapore;
Ions; Through-silicon vias; Electrodes; Electron traps; Geometry; Silicon; Radio frequency;
机译:TSV集成表面电极离子阱,用于可伸缩量子信息处理
机译:微观表面电极离子阱,可扩展量子信息处理
机译:用于可扩展量子信息处理的超细表面电极离子阱
机译:具有3D-TSV集成的微制成的表面电极离子阱,可伸缩量子计算
机译:微制造的表面阱和腔体集成,用于阱离子量子计算。
机译:基于双面光微腔内耦合量子点中静态自旋量子位的可扩展量子计算
机译:集成荧光收集光学器件的特性 微加工表面电极离子阱