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Synthesis of Nanoporous Gold Structures via Dealloying of Electroplated Au-Ni Alloy Films

机译:通过电镀Au-Ni合金膜脱合金合成纳米孔金结构

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摘要

We studied the synthesis of nanoporous gold (NPG) films using electrodeposited Au-Ni as a precursor for dealloying. Potentiostatic dealloying of amorphous Au-Ni (Ni 65, 77, and 85at%) films at 0.7V_(SCE) in 10mM H_2SO_4, resulted in the formation of nanoporous structures with average pore diameter increasing with Ni content from 69 to 107 ran. Alloy films with high Ni content are more susceptible to surface cracking due to large internal stresses. Potentiostatic dealloying of amorphous Au-Ni 73at% at 1.0V, 1.3V, and 1.5V_(SCE) in 10mM H_2SO_4 yielded NPG structures with an average pore size which decreased with increasing applied voltage, from 57nm to 36nm. At higher anodic potentials, surface cracks become more apparent. Finally, the NPG structure could be tuned also by potentiostatic dealloying of partially crystallized Au-Ni 73at% at 0.7V_(SCE) in 10mM H_2SO_4. The average pore size measured about 9nm, much smaller than those observed in dealloyed amorphous Au-Ni films.
机译:我们研究了使用电沉积Au-Ni作为脱合金前驱体的纳米多孔金(NPG)膜的合成。非晶态Au-Ni(Ni 65、77和85at%)膜在10mM H_2SO_4中以0.7V_(SCE)进行恒电位脱合金处理,形成了平均孔径随Ni含量从69到107 ran增大的纳米孔结构。具有高Ni含量的合金膜由于较大的内应力而更易于表面破裂。在10mM H_2SO_4中于1.0V,1.3V和1.5V_(SCE)下非晶态Au-Ni 73at%的恒电位脱合金产生了NPG结构,其平均孔径随施加电压的增加而减小,从57nm减小到36nm。在较高的阳极电势下,表面裂纹变得更加明显。最后,还可以通过在10mM H_2SO_4中以0.7V_(SCE)对部分结晶的Au-Ni 73at%进行恒电位脱合金来调节NPG的结构。测得的平均孔径约为9nm,远小于脱合金非晶Au-Ni膜中观察到的孔径。

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