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Synthesis of Nanoporous Gold Structures via Dealloying of Electroplated Au-Ni Alloy Films

机译:通过电镀Au-Ni合金薄膜的造理合成纳米多孔金结构

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We studied the synthesis of nanoporous gold (NPG) films using electrodeposited Au-Ni as a precursor for dealloying. Potentiostatic dealloying of amorphous Au-Ni (Ni 65, 77, and 85at%) films at 0.7V{sub}(SCE) in 10mM H{sub}2SO{sub}4, resulted in the formation of nanoporous structures with average pore diameter increasing with Ni content from 69 to 107nm. Alloy films with high Ni content are more susceptible to surface cracking due to large internal stresses. Potentiostatic dealloying of amorphous Au-Ni 73at% at 1.0V, 1.3V, and 1.5V{sub}(SCE) in 10mM H{sub}2SO{sub}4 yielded NPG structures with an average pore size which decreased with increasing applied voltage, from 57nm to 36nm. At higher anodic potentials, surface cracks become more apparent. Finally, the NPG structure could be tuned also by potentiostatic dealloying of partially crystallized Au-Ni 73at% at 0.7V{sub}(SCE) in 10mM H{sub}2SO{sub}4. The average pore size measured about 9nm, much smaller than those observed in dealloyed amorphous Au-Ni films.
机译:我们研究了使用电沉积的Au-Ni作为用于造成的前体的纳米多孔金(NPG)膜的合成。在10mm H {sub} 2SO {sub} 4中0.7V {sub}(sce)的无定形Au-ni(Ni 65,77和85at%)膜的电位造影型膜导致形成具有平均孔径的纳米多孔结构增加NI含量从69到107nm。由于大的内应力,具有高Ni含量的合金薄膜更容易受到表面裂缝的影响。在10mm H {sub} 2so {sub} 4中的1.0V,1.3V和1.5V {Sub}(SCE)的恒大Au-Ni 73at%的促静音造成的无定形Au-Ni 73at%} 4产生了平均孔径的NPG结构,随着施加电压的增加而降低。 ,从57nm到36nm。在较高的阳极电位下,表面裂缝变得更加明显。最后,可以通过在10mm H {sub} 2so {sub} 4中以0.7V {sub}(sce)的部分结晶的Au-Ni 73at%的稳压造影,通过促电位造成的部分结晶的Au-Ni 73At%来调整NPG结构。平均孔径测量约9nm,远小于在熟石化无定形Au-Ni薄膜中观察到的孔径。

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