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Electron Transfer at the n-InP poly(pyrrole) Interface

机译:n-InP处的电子转移聚吡咯界面

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Measurements of the barrier height by capacitance-voltage techniques and of the equilibrium exchange current density by current-voltage techniques are performed on the rectifying interface between n-InP and poly(pyrrole) (chemically polymerized and characterized by an electrochemical potential of =0.2V vs. SCE). The current-voltage data yielded a quality factor of 1.2 ± 0.1 and an equilibrium exchange current density of (1.2 ± 0.6) × 10~(-9) A cm~(-2). The capacitance-voltage data yielded a barrier height of 0.73 ± 0.02 V and measured dopant densities within 15% of the expected value. These data, taken together, are inconsistent with thermionic emission theories developed to describe inorganic semiconductor ) metal interfaces and often applied to inorganic semiconductor | doped conjugated polymer interfaces. In particular, the ratio of the rate constant for majority carrier electron capture (surface recombination velocity) at the n-InP | poly(pyrrole) interface to that at n-InP | metal interfaces is found to be (6 ± 5) × 10~(-3).
机译:在n-InP和聚吡咯之间的整流界面上进行了电容-电压技术对势垒高度的测量,而电流-电压技术对平衡交换电流密度进行了测量(化学聚合并以0.2V的电化学势表征)与SCE)。电流-电压数据得出的品质因数为1.2±0.1,平衡交换电流密度为(1.2±0.6)×10〜(-9)A cm〜(-2)。电容电压数据得出的势垒高度为0.73±0.02 V,测得的掺杂剂密度在预期值的15%以内。这些数据加在一起,与为描述无机半导体金属界面而开发的热电子发射理论不一致,并且经常应用于无机半导体|掺杂的共轭聚合物界面。尤其是,n-InP |时多数载流子电子俘获的速率常数之比(表面复合速度)。 poly(吡咯)界面与n-InP的界面|发现金属界面为(6±5)×10〜(-3)。

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