Quantitative evaluation of passive-aligned laser diode-to-fiber coupling is presented. From the assembly of 250 transmitter optical subassemblies, flip-chip bonding of laser chips and fiber fixing yields are reported. The coupling characteristics of passive-aligned laser diode modules are evaluated in comparison with the active alignment data and the misalignment tolerances. The assembly and coupling results have showed about 80% overall yield and 1.79 dB/spl plusmn/1.55 dB excess coupling loss, respectively.
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机译：定量评估了被动对准激光二极管与光纤的耦合。从250个发射器光学组件的组装中，报告了激光芯片的倒装芯片键合和光纤固定成品率。与有源对准数据和未对准公差相比，评估了无源对准激光二极管模块的耦合特性。组装和耦合结果分别显示了约80％的总成品率和1.79 dB / spl plusmn / 1.55 dB的过量耦合损耗。
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