Device Platforms Res. Labs. NEC Corp. Sagamihara;
cooling; copper; integrated circuit packaging; integrated circuit testing; large scale integration; microprocessor chips; thermal analysis; Cu; embedded high-pin-count LSI; epoxy resin; heat sink; microprocessor; package-level thermal cycle test; personal-computer-like system board; thermal resistance; ultra-thin package; warpage characteristics;
机译:具有Cu板的高引脚数LSI的嵌入式有源封装技术
机译:具有Cu板的高引脚数LSI的嵌入式有源封装技术
机译:嵌入式高引脚数LSI芯片封装的电气设计和技术
机译:用于CU板支撑的嵌入式高针计数LSI的新型超薄包装
机译:灵活的超薄嵌入式模具封装。
机译:氧化铝载体上Cu和Ni的制备表征及其在平行板反应器合成低温金属酞菁中的应用
机译:LSI包趋势 - 高密度包装的LSI套件。