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Comprehensive Demonstration and Physical Origin of HfO_2 Gate Stacks: Band Alignment, V_(FB) Shift and Fermi Level Pinning

机译:HfO_2栅堆叠的全面演示和物理起源:能带对准,V_(FB)移位和费米能级固定

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摘要

Band alignment of TiN/HfO_2/SiO_2/Si stack is systematically investigated by X-ray photoelectron spectroscopy. The differences of binding energies of Si 2p core level between SiO_2 and Si substrate are experimentally found to decrease with the sequence of 5 run SiO_2/Si, 4 nm HfO_2/5 nm SiO_2/Si and 2 nm HfO_2/5 nm SiO_2/Si stacks. The p-type Schottky barrier heights at TiN/HfO_2 interface of TiN/HfO_2/SiO_2/Si stack are experimentally estimated to increase with thicker HfO_2 thickness. A physical model based on band alignment of TiN/HfO_2/SiO_2/Si stack is employed to successfully explain these experimental results. The flatband voltage (V_(FB)) of TiN/HfO_2/SiO_2/Si stack is demonstrated by the proposed model based on band alignment of entire gate stack. The positive V_(FB) shift of TiN/HfO_2/SiO_2/Si stack and Fermi level pinning are also physically demonstrated by this model and attributed to interface induced gap states at TiN/HfO_2 and HfO_2/SiO_2 interfaces.
机译:利用X射线光电子能谱系统地研究了TiN / HfO_2 / SiO_2 / Si叠层的能带取向。实验发现SiO_2与Si衬底之间的Si 2p核能级的结合能的差异随着5游程SiO_2 / Si,4 nm HfO_2 / 5 nm SiO_2 / Si和2 nm HfO_2 / 5 nm SiO_2 / Si堆叠的顺序而减小。据估计,TiN / HfO_2 / SiO_2 / Si叠层的TiN / HfO_2界面处的p型肖特基势垒高度随HfO_2厚度的增加而增加。基于TiN / HfO_2 / SiO_2 / Si堆栈的能带对准的物理模型可以成功地解释这些实验结果。基于整个栅叠层的能带对准,通过提出的模型证明了TiN / HfO_2 / SiO_2 / Si叠层的平带电压(V_(FB))。 TiN / HfO_2 / SiO_2 / Si叠层的正V_(FB)位移和费米能级钉扎也通过该模型进行了物理证明,并归因于TiN / HfO_2和HfO_2 / SiO_2界面处的界面诱导间隙状态。

著录项

  • 来源
  • 会议地点 Seattle WA(US);Seattle WA(US)
  • 作者单位

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Microelectronics Department, North China University of Technology, Beijing 100041, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

    Key Laboratory of Microelectronics Devices Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 材料;材料;
  • 关键词

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